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PCA9538: Vapour Phase and Post Build Wash

Part Number: PCA9538

I am using the PCA9538DGVR in a design and need to know if the component can be put through Vapour Phase and Post Build Wash.

  • Hey Michael,

    I've reached out to our quality team to see if they know the answer to this. I'll update you when I hear back.

    Thanks,

    -Bobby

  • Michael,

    Our quality engineer stated we do not qualify our devices with the Vapor Phase reflow procedure but if you follow JEDEC profile and keep the maximum temperature below 260C then there should be no problem.

    In regard to the post build wash, this is not done through the qualification process so I did not get an answer on this. I'll try to find someone else who may know and get back to you.

    -Bobby
  • Michael,

    Here is the response I got back from a packing engineer:

    "By “Post build”, If customer is talking about after SMT assembly of this TI’s leaded package (SOIC or TSSOP) to their board, then we’ll need to know more about the details of their “wash” before assessing the risk (what solvent is used, time and temperature)."

    If you are able to provide me with more details, I can send him the information and let you know.

    Thanks,
    -Bobby