Hi,
I am designing electronic equipment with DP83848M.
The DP83848M includes a thermal pad, which is recommended to connect to the PCB ground via four thermal vias on the data sheet.
Our development equipment PCB includes thermal layer and, the second layer of development equipment PCB is the thermal layer.
For the efficient heat dissipation of the DP83848M in our development PCB, is it better to connect the thermal pad to the thermal layer via soldering?