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ISO5852SDWEVM-017: EVM questions not answered in the documentation

Part Number: ISO5852SDWEVM-017

Is the PCB layout in in SLLU298 optimized for minimum ground bounce?  I was trying to look at how the layers are stacked up and what are being used as shields, but the figures (Fig 12 - 16) are too blotchy to really tell what the traces are actually doing (which traces are connected and which are just resolution errors in the document).  Can you send separate drawings for those figures with better resolution please.

Thank you - John