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DP83848J: DP83848J thermal Heatsinking Info

Prodigy 490 points

Replies: 2

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Part Number: DP83848J

Hello e2e Ethernet Forum, we have been using the DP83848J ethernet PHY for a number of years. We have been connecting the thermal pad under the QFN to the ground layer and bottom layer through a number of vias. I am not sure this is completely necessary, but I am unable to find documentation to guide the thermal layout requirements. I have checked the datasheet, AN-1469, and SPRA953C.

 

Do you have a thermal layout guide for this device?

 

This is a top layer footprint showing (9) vias under the package. I think this might be overkill…

Thank you.

  • Hi Dave,

    The thermal pad (DAP) also functions as ground for the device, so its required to connect it to ground layer on the system. Also the recommended land pattern is mentioned in the datasheet towards the end. Can customer use that as a guide for connection the DAP?

    -Regards,
    Aniruddha
  • In reply to Aniruddha Khadye:

    HI Dave,

    I will be closing this thread due to inactivity. Please post a new thread if there are more follow up questions and link this thread in your new post.

    -Regards,
    Aniruddha

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