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Part Number: TPD2EUSB30A
We are having issues with soldering TPD2EUSB30ADRTR. We are a custom manufacturing company and we manufacture printed circuit assemblies for many customers. This particular component tends to float on the solder when it goes through the reflow oven. The oven profile matches the paste manufacturer's recommended settings. I've also tried adding a soak of about 40 seconds (180C-200C) vs the RTS profile.
The initial aperture size matches the recommended pad size. My thought was that we were exhausting the flux because the paste brick was so small. We ordered another stencil with larger apertures, however this resulted in the part sitting on top of a larger solder ball. Some of the components will exhibit wetting, but not to an acceptable degree. Our ovens are not nitrogen, just air, 10 zones (Heller.)
We've seen the same issue on the customer's other assembly that uses the same part. We were using two different reels with different date codes and both assemblies had the same issue. They were being processed on different lines.
Has anyone been able to get a side fillet on these? I don't expect toe fillet due to the way the ends are cut which expose the copper. Or should I consider these as bottom termination components and only inspect for connectivity on the bottom of the pad?
Cameron PhillipsApplications | email@example.comHigh Side Switches/ESD & Surge Protection
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