SN65HVD75: About via connection

Kenji Ohno1

Genius 5095 points

Part Number: SN65HVD75

Hi Team,

I saw the description of (Φ0.2) VIA in LAND PATTERN EXAMPLE of the data sheet.

Does this mean that it is connected to the ground for heat dissipation?

Best Regards,

Kenji

over 5 years ago

0 Max Robertson over 5 years ago

TI__Guru 62910 points

Hello Kenji-san,

Yes, it is generally recommended to use vias in the thermal pad to improve the thermal conductivity between the pad and other metal used on the PCB (typically the ground plane) so that heat can be dissipated more evenly over a larger area. Please let me know if you have any further questions on this.

Regards,
Max

0 Kenji Ohno1 over 5 years ago in reply to Max Robertson

Genius 5095 points

Max-san,

Thank you for your answer.
I understood well.

Regards,
Kenji

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SN65HVD75: About via connection