Hi,
Good day. I hope everything's fine over there.
Our customer were using the TUSB211. In their production test there will be an initial state when chips VCC, D1P, D1M, D2P, D2M pins are floating (VCC pin connected to GND pin via decoupling caps) and GND pin is connected to test system ground via 11k resistor.
After this initial state a 3V3 voltage will be applied in turns to D1P+D2P, D1M+D2M and GND pins.
They want to know if there is a risk that these above mentioned situations affect the reliability of the chip somehow?
Thank you and have a great day.
Regards,
Cedrick