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TPD6E05U06: Clapmping voltage question
Part Number: ESD122
I read this great articles on ESD basics (https://e2e.ti.com/blogs_/b/powerhouse/archive/2017/12/06/esd-fundamentals-part-3-clamping-voltage ) , and I left my questions below. But I am not sure whether the author is still work at TI , so I post my question here to discuss together.
The author mentioned we could use ESD122 TLP curves to get accurate Vclamp value under certain current vaule, and he listed that 2/4/6/8kV IEC strike correspond to 4/8/12/16A TLP currents.(as marked in below picture).
I really want to consult how do we get this relationship : IEC Voltage strike (kV) x2 equals TLP currents ?
PS：I refer to 61000-4-2, the correct data should be 7.5/15/22.5/30A Ipp current correspond to 2/4/6/8kV IEC strike .
Happy to have this discussion. Could you send me a link to the documentation you are referencing?
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In reply to Matt Smith3:
I do not get the original copy of IEC-61000-4-2 standard, but you can see page 9 of this link(also snapshot below), and I confirmed the IEC standard data in this slide is correct according to google search.
So, I guess this TI's bolg article means: IEC voltage strike x2 correspond to I_30ns(current at 30ns), which match the numbers' relationship above, in math.
But why using the current at 30ns instead of the first peak current? That's where my confusion is. Thanks !
In reply to XY:
The reason we use the 30 ns current instead of the first peak is due to the energy of the waveform. While the first peak is much taller than the 30 ns mark, it only lasts for a very brief amount of time, which means less energy. The 30 ns mark, however, gives us a more realistic representation of the amount of current the diode can withstand over time. There is more area under the curve, which means more energy, and many of the thermal failures occur due to the total energy of that pulse.
Let me know if this clears things up.
Figure 1 from this OnSemi tech note intuitively shows that the current waveforms of IEC 8KV and TLP 16A are very similar.
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