My customer is using the LMH0302 to drive a 3G-SDI signal to a BNC connector that mates directly the the chassis. Therefore, the BNC connector is mated to the Chassis ground.
In Figure6 (p.11) - "Layout Example" in the LMH0302 datasheet, it is not clear if the ground of the "BNC Anti-pad" is connected to the Board/PCB ground, or if this is the Chassis ground.
Please help with the following questions:
1. Is the light green ground section on the "Layout Example" the Board/PCB Ground? The Chassis Ground? Or both (ie, PCB and Chassis ground are tied together)?
2. Should the diagram show gold solder connections above and below the BNC Anti-Pad such that the BNC connector is connected to the light green GND?
3. In this case, since the BNC connector mates directly to the chassis, is it recommended to tie the chassis ground directly to board ground? Or are there any other recommendations (typically one would want to filter out chassis noise with ferrite bead + inductor)?
Thanks!
Andy