Hi All,
A layout example of DP and DM is described in DataSheet.
Please teach me the layout of the following widths.
①
A:0.185mm
B:0.215mm
C:0.185mm
②
A:0.150mm
B:0.150mm
C:0.150mm
Best Regards
Koji Hayashi
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Hi All,
A layout example of DP and DM is described in DataSheet.
Please teach me the layout of the following widths.
①
A:0.185mm
B:0.215mm
C:0.185mm
②
A:0.150mm
B:0.150mm
C:0.150mm
Best Regards
Koji Hayashi
Hi,
please find the exact dimensions of the pads at the end of the datasheet or in the package outline document for RWB package. Please note that the D1P should be connected with D2P and D1M with D2M., which can be done by routing the traces straight through as shown in the layout example
For the widths of DP and DM in respect to your drawing this should be:
A 0.2mm
B 0.2mm
C 0.2mm
Best regards
Cevin
Hi,
the change in width can cause impedance mismatches. Please ensure 90 Ohm differential impedance routing throughout the board. Please find some guidelines for High-Speed Interface layout under following link:
http://www.ti.com/lit/an/spraar7f/spraar7f.pdf
Best regards
Cevin
Hi Cevin-san
A confirmation request came from my customer regarding the wiring pattern.
Is it possible to check?
If possible, we will send you materials, so please tell me your e-mail address.
Best Regards
Koji Hayashi
Hayashi-san,
The customer's layout diagram with 150um/150um is acceptable. The discontinuities are minimal and should not affect the High-Speed signaling.
Regards,
Undrea
Hi Undrea-san
Thank you for support.
I would like to confirm,upper figure is no good, lower fiture is good.
Is it correct ?
Best Regards
Koji Hayashi
Correct. I wouldn't say the upper figure is no good, the lower figure would yield slightly better results. I wouldn't expect the upper figure to cause any significantly noticeable signal integrity issues at 480MB/s.
Regards,
Undrea
Undrea-san
Thank you for response.
I was understood.
Best Regards
Koji Hayashi