Team,
From your experience:
Is it possible to design a PCB that could enable any of both package to be mounted?
For example can a PCB side be designed to accept both footprint as"overlayed" as below and mount the IC that would be available at this point of time?
(the isolation barrier would be aligned for both packages as shown below)
Thanks in advance,
A.
Hi AnBer,
Thanks for reaching out.
Please take a look at the EVM DIGI-ISO-EVM (link below) that has multiple footprints overlapped (see image below) to accommodate all available digital isolator footprints in one EVM to provide a general purpose digital isolator EVM. Overlapping DW and DBQ was also attempted but there was very little space between the package to run the traces from DBQ pads to DW pads using standard trace width that was accepted by most PCB vendors. Hence, we couldn't overlap DW and DBQ.
But if customer's PCB vendors agrees to support smaller trace widths (maybe at extra cost) then customer can change design rules in their PCB software to allow smaller trace widths and narrower gaps between traces, then they will be able to run the traces from DBQ pads to DW pads without any issues. This is achievable if customer works with the PCB vendor.
I hope that answers your question, thanks.
Regards,
Koteshwar Rao
