HI team,
To compared with opt-coupler TLP2355, why they are same isolation level 3750Vrms even isolation thickness differs? Does it depend only creepage distance or clearlance?
Regards,
Hayashi
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HI team,
To compared with opt-coupler TLP2355, why they are same isolation level 3750Vrms even isolation thickness differs? Does it depend only creepage distance or clearlance?
Regards,
Hayashi
Hello Hayashi-san,
Thank you for reaching out. Traditional Opto-coupler technology uses an LED and a photo diode separated by an air or a material with a weak dielectric material. The dielectric material has a constant of 1V/um for air, or 20V/um for epoxy which can age and deteriorate over the device's lifetime, requiring the insolation thickness to be thicker to provide higher isolation values.
Since the ISOM8710 uses newer isolation technologies and high-quality dielectric material (500V/um), such as silicon dioxide (SiO2), the dielectric material does not need to be as thick to provide high-quality insulation. The dielectric material of TI's opto-emulators are approximately 25 times stronger than the average optocoupler dielectric material.
Please see the article Distance Through Insulation: How Digital Isolators Meet Certification Requirement. for more information on how out opto-emulators meet certification requirements.
I hope this helps. Let me know if you have any more questions.
Best,
Andrew
Hello Hideki-san,
I will also note that the ISOM8710 has an inverted output, while the TLP2355 has a buffered output. The logic tables are inverse of each other, which may or may not matter.
However, the TLP2358 is an inverter output version of the TLP2355 and therefore the ISOM8710 will be a p2p drop in replacement for the TLP2358.
Note that while the underlying technology is different, with the ISOM8710 utilizing a newer isolation technology, the device is design to be drop in replacement for opto coupler devices and works with the same input and provides the same output response as a photo diode based device.
Best,
Michael