Hi team,
Good day!
Recently I'm learning TI isolation products. I would like to know more specific documents about some conceptions.
- About creepage and clearance, I understand the conception on IC. And bigger package allows higher isolation capabilities. How can I promote ICs with suitable creepage and clearance? Are there documents explaining clearance and clearance more detailed?
- I would like to know the phenomenon when capacitive isolation barrier is broken down.
- Is there international standard to define and differentiate basic isolation and reinforced isolation? So I could promote suitable isolation level to customers.
- Optical isolation is limited by LED turn-on speed in high speed data application. I would like to know the data rate boundary separating optical isolation, magnetic isolation and capacitive isolation.
Looking forward to your kind reply.
Thanks.
Victoria