Tool/software:
Hello,
I am using ISO7741DBQR and ISO7421MDREP in one of our designs. This is a very dense, 20 layer circuit card. The datasheet indicates we need to leave all copper layers below the IC free of copper. This is going to eat up a lot of copper area and I am afraid it may not be possible to use the isolators in the design if we did this.
The only reason we isolate signals is to prevent a current carrying reference between two circuit cards, and there's really no requirement on the isolation voltage (grounds on both sides are connected via a common mode choke, so there's no potential difference except some noise between them). There are communication signals, operating at 500Kbps.
Question is, can I have the chassis ground plane (or any other plane you suggest, even a floating plane) below the Digital Isolator and use the remaining layers below for other power/routing (we can avoid vias in this area). I appreciate any help you could offer.
Thank you,
Tharaka.
