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ISO7763-Q1: Difference between SSOP and SOIC

Koji Hayashi92
Mastermind 6970 points
Part Number: ISO7763-Q1
Other Parts Discussed in Thread: ISO7763

Hi TI-team

My customer trying to use SSOP package for communication between microcomputers in ECU.

Should we consider SOIC as a package that assumes that ESD is applied directly, such as connection to other ECUs ?

How should SSOP and SOIC be used properly ?

Best Regards,

Koji Hayashi

  • 0
    TI__Mastermind 49485 points

    Hi Koji,

    I am assuming you are referring to the 16-pin SSOP and 8-pin NB (narrow body) SOIC packages.
    There should not be much of different in electrical performance between SSOP package and SOIC package devices. There is only a small difference in clearance/creepage value between these packages, otherwise nothing else much.

    Please do note that ISO7763 is only available in SSOP package and not available in NB SOIC package. ISO7763 is available in 16-pin WB (wide body) SOIC package which is a much bigger package offering much higher clearance/creepage and hence much higher isolation specs. Otherwise most of the electrical specifications/performances should remain the same.

    Let me know if you have any other questions, thank you.

    Regards,
    Koteshwar Rao

  • 0 in reply to Koteshwar Rao
    Mastermind 6970 points

    Hi koteshwar-san

    Thank you for response.

    Sorry for the late reply.

    I was taking a holiday at the end of the year.

     

    I understand.

    I noticed that it was mentioned at the beginning of "3 Description" in the data sheet.

    "The ISO776x-Q1 devices are high-performance, sixchannel digital isolators with 5000-VRMS (DW package) and 3000-VRMS (DBQ package) isolation ratings per UL 1577."

     

    Best Regards,

    Koji Hayashi