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ISO3088: Mechanical stress on SO16W package

Alan Westrop
Prodigy 20 points
Part Number: ISO3088

To extract heat from a multi PCB stack we are considering insertion of heat transfer materials and thermal gap fillers. This will apply compressive force to the board mounted components with resulting stress to the lead frame and solder joints. I have found data for the various BGA packaged devices, but so far have been unable to find information relating to SO16W package.

Can anyone provide information on this?

  • 0
    TI__Expert 6955 points

    Alan,

    Are you needing info from something like Board reliability Report? If so, we will not be able to provide this report via this forum. For BLR report, please contact your local TI sales representative or FAE and they will request it from within the TI product line. 

    Respectfully,

    Lucas Schulte

  • 0 in reply to Lucas Schulte9
    Prodigy 20 points

    Lucas,

    The isolators are included on a board with multiple height components, some of which we are looking to provide a thermal path to remove heat to improve long-term reliability and possibly raise the rated ambient for the equipment. To achieve this we are looking at options to include a thermally conductive path with suitable gap fillers to ensure thermal transfer. To simplify the form of the heat collector, the isolators will be within its outline, with the subsequent requirement that they will accommodate the compressive force applied to conform the different gap filling materials to the heights of the associated components.

    The typical mechanical loading figure for BGAs is in the order of 16g/ball on a 1mm pitch. The area of the isolators over which the force is applied is 10.5 x 7,6 = 79.8 mm2, which at the same level of force per unit area equates to 1,277 g, or 1.277 kg of force (!!!) Can the lead frame and solder joints withstand this level of force with no impact on long term reliability?

  • 0 in reply to Alan Westrop
    TI__Expert 6955 points

    Alan,

    I apologize for the delay in getting back to you. I asked around managed to get some information related to what are asking for.

    There were some compression tests conducted on a 14 pin gull wing package that also had a thermal pad on top. It could withstand 50 Newtons of force. While I know this isn't the 16 pin DW package, maybe this offers a useful reference.

    Respectfully,

    Lucas