There is a big differences between a 16-pin SOIC wide-body (DW) and a 8-pin SOIC narrow-body (D). The greatest difference is in the maximum working isolation voltage, DW has 1500 V RMS, while D has only 400 V RMS. There is also a big external clearance difference (DW 8 mm -> D 3.7 mm).
Is it possible to use bigger working voltage in systems when all electronic elements are molded with epoxy resin?
Zajc Franc