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ISO1500: Contents of New Product Update

Part Number: ISO1500
Other Parts Discussed in Thread: ISO1044

Dear TI Team

I checked the ISO 1500 by looking at the Webinar document of the New Product Update below.
https://www.ti.com/lit/ml/slyp703/slyp703.pdf?ts=1604997314464&ref_url=https%253A%252F%252Ftraining.ti.com%252F


I want you to answer the following questions.
1. ISO1500 releases smaller packaged products such as QSOP packages. (ISO1044 SOIC (D) packaged products have also been released)
I think that if the package is made smaller, the creepage distance inside the device will be smaller, but is the ISO1500 QSOP package a product that clears the creepage distance required for insulation?
(When I check the Surge Voltage, it says 4Vpk (Basic), so I think it covers only basic insulation.)

2. Are there any plans to release digital isolation products related to interfaces such as RS-232 that were not mentioned in the New Product Update?
(Looking at the materials, there were CAN FD, I2C, and RS-485, but I would be grateful if you could tell me why you picked them up.)

Best Regards,

Y.Ottey

  • Hi Y.Ottey,

    Thanks for reaching out. Please see my inputs below,

    1. Yes, ISO1500 and ISO1044 are available in small packages, SSOP (DBQ) and NB SOIC (D), respectively. These are one of the smallest RS-485 and CAN isolators that you can find in the industry.
      1. Creepage / clearance of a device in a given package are directly dependent on external dimensions of the package. These two devices meet all the isolation ratings listed in respective insulation characteristics table of datasheet and the creepage / clearance of these devices is sufficient to meet those isolation ratings.
      2. Reinforced isolation requires 10kV surge rating while these two small packages do not meet such a surge requirement and hence are only rated for basic isolation. We do have devices in WB SOIC packages for both RS-485 and CAN that meet reinforced isolation requirements..
      3. A lot of applications involving RS-485 and CAN only require ground loop isolation and do not have high isolation requirements. For such applications, both these devices provide a much smaller solution and improve space and cost significantly.
    2. Currently, we do not have any dedicated isolator for RS-232 interface and TI offers a two chip solution using digital isolator paired with RS-232 transceiver. The reason for us releasing devices to interfaces CAN FD, I2C and RS-485 is that these are the most commonly used interfaces in a broad range of applications. We do see high demand for isolators supporting these interfaces.

    Let me know if you have any other questions, thanks.

    Regards,
    Koteshwar Rao