Other Parts Discussed in Thread: ISO1044
Dear TI Team
I checked the ISO 1500 by looking at the Webinar document of the New Product Update below.
https://www.ti.com/lit/ml/slyp703/slyp703.pdf?ts=1604997314464&ref_url=https%253A%252F%252Ftraining.ti.com%252F
I want you to answer the following questions.
1. ISO1500 releases smaller packaged products such as QSOP packages. (ISO1044 SOIC (D) packaged products have also been released)
I think that if the package is made smaller, the creepage distance inside the device will be smaller, but is the ISO1500 QSOP package a product that clears the creepage distance required for insulation?
(When I check the Surge Voltage, it says 4Vpk (Basic), so I think it covers only basic insulation.)
2. Are there any plans to release digital isolation products related to interfaces such as RS-232 that were not mentioned in the New Product Update?
(Looking at the materials, there were CAN FD, I2C, and RS-485, but I would be grateful if you could tell me why you picked them up.)
Best Regards,
Y.Ottey