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<?xml-stylesheet type="text/xsl" href="https://e2e.ti.com/cfs-file/__key/system/syndication/rss.xsl" media="screen"?><rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:slash="http://purl.org/rss/1.0/modules/slash/" xmlns:wfw="http://wellformedweb.org/CommentAPI/"><channel><title>Isolation</title><link>https://e2e.ti.com/support/isolation-group/isolation/</link><description>&lt;p style="display:none;"&gt;blank&lt;/p&gt;</description><dc:language>en-US</dc:language><generator>Telligent Community 13</generator><item><title>Forum Post: RE: ISO7721: whether we have the IEC 60664 test report for the ISO7721DWVR?</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1647397/iso7721-whether-we-have-the-iec-60664-test-report-for-the-iso7721dwvr/6359338</link><pubDate>Tue, 26 May 2026 19:28:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:e704b244-c3da-45e9-8af2-bb3dbf56c162</guid><dc:creator>Saleem Marwat</dc:creator><description>Hi Terry, We don&amp;#39;t get any 3rd party testing done per IEC 60664-1. Therefore no such test report is available. Thanks, Saleem Marwat</description></item><item><title>Forum Post: RE: ISO64XX-WB-EVM-DOC-CERT: ISOW774x: Spice model</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1647369/iso64xx-wb-evm-doc-cert-isow774x-spice-model/6359334</link><pubDate>Tue, 26 May 2026 19:25:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:17593ade-77a0-4068-a631-689df47872db</guid><dc:creator>Ethan White</dc:creator><description>Please reach out to the field engineer you were talking to earlier, Jack. He can connect us, just to make sure we are all above board with the NDA.</description></item><item><title>Forum Post: RE: ISO64XX-WB-EVM-DOC-CERT: ISOW774x: Spice model</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1647369/iso64xx-wb-evm-doc-cert-isow774x-spice-model/6359313</link><pubDate>Tue, 26 May 2026 19:16:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:aab1152f-3af4-45b6-8f53-f960166d59c0</guid><dc:creator>Fan Zhang</dc:creator><description>The B side of the chip has 2 inputs and 2 outputs. They are stuck at the same level. I cannot share our schematic publicly. Is there a better way to transfer? Maybe I can do email since we have NDA.</description></item><item><title>Forum Post: RE: ISO64XX-WB-EVM-DOC-CERT: ISOW774x: Spice model</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1647369/iso64xx-wb-evm-doc-cert-isow774x-spice-model/6359308</link><pubDate>Tue, 26 May 2026 19:10:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:ce78a89d-08e0-4cde-b995-6eff24ff62cb</guid><dc:creator>Ethan White</dc:creator><description>If you could provide a schematic and any waveforms you have from this area that could help me resolve your issue here. Could you also clarify what you mean by &amp;quot;input or output&amp;quot;, what pins are you referencing specifically?</description></item><item><title>Forum Post: RE: ISO64XX-WB-EVM-DOC-CERT: ISOW774x: Spice model</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1647369/iso64xx-wb-evm-doc-cert-isow774x-spice-model/6359288</link><pubDate>Tue, 26 May 2026 19:02:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:bc8d3e83-6c7c-4b5d-882e-f891ba10a73e</guid><dc:creator>Fan Zhang</dc:creator><description>We have a board that has the input or output from this part stuck at 1.46V. We are looking for the root cause and want to understand if the VSOOUT is somehow stuck at this level for some reason, and if so, what conditions could lead to this.</description></item><item><title>Forum Post: RE: ISO64XX-WB-EVM-DOC-CERT: ISOW774x: Spice model</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1647369/iso64xx-wb-evm-doc-cert-isow774x-spice-model/6359131</link><pubDate>Tue, 26 May 2026 17:44:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:da74cbc7-249a-4cc7-821f-4289e8834771</guid><dc:creator>Ethan White</dc:creator><description>What exactly are you trying to simulate? Is there a reason you cannot use the ISO7742 SPICE model + an external voltage source?</description></item><item><title>Forum Post: RE: ISOW7844: Clarification on Grounding Practice – Impact of Not Externally Shorting Grounds</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1649140/isow7844-clarification-on-grounding-practice-impact-of-not-externally-shorting-grounds/6359077</link><pubDate>Tue, 26 May 2026 17:05:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:113ad289-9c7f-4562-8e87-de35fcfbf4cd</guid><dc:creator>Naveena Sanaboina</dc:creator><description>Hello Clemens Ladisch, Thanks for your response. Sorry for the confusion. Problem is IC regulator is not Outputting a desired of 3.3V out with respect to 3.3V input when SEL pin is Grounded. We are looking for the possible causes.</description></item><item><title>Forum Post: RE: ISOW7844: Clarification on Grounding Practice – Impact of Not Externally Shorting Grounds</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1649140/isow7844-clarification-on-grounding-practice-impact-of-not-externally-shorting-grounds/6359066</link><pubDate>Tue, 26 May 2026 16:59:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:e6ed7f32-f974-4e4d-b728-57b7feaf0e12</guid><dc:creator>Naveena Sanaboina</dc:creator><description>Hi Varun, Thanks for response. Sorry for the confusion. I mean on the isolated ground on noisy side of the IC where 2 GND2 pins where available with IC( ISOW784416-Pin SOIC-WB). They were not connected external to IC with in the board, is what I suppose to ask in the query. But I got to know they are commonly connected in one of the layers. Our failure is being investigated to root caused to ISO IC voltage regulation has (is generating 1.8V instead of 3.3V) . managed to check SEL connection and its traces. No damage. all decoupling capacitor are fine. load has disconnected to locate failure. Have you seen this kind of failures with this IC before ? What could have be a possible cause ? In our design minimum load for regulation 1K across isolated VISO and GND also provided as a precaution. Decoupling cap of 10uF and 0.1uF as recommended in datasheet was implemented . What do you think would be the possible cause of it ?</description></item><item><title>Forum Post: RE: ISOUSB211: ISOUSB211 Packet Corruption during Enumeration?</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1637486/isousb211-isousb211-packet-corruption-during-enumeration/6359031</link><pubDate>Tue, 26 May 2026 16:37:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:abc7da21-3f36-483c-b2c0-96f9109d693a</guid><dc:creator>John Seaber</dc:creator><description>Hi Varun, Attached is a full USB descriptor dump from the DragonFly Red (captured via TDD v2.19). The relevant highlights: - bcdUSB = 0x0200 — the device self-identifies as USB 2.0 - It operates at Full-Speed as a USB Audio Class 1.0 device with asynchronous isochronous endpoints — a standard and compliant USB 2.0 profile - The descriptor structure (AC interface, AS interface, format type, endpoint descriptors) is well-formed and consistent with the UAC 1.0 specification The Dragonfly enumerates and functions correctly on every host we&amp;#39;ve tested, including multiple Windows PCs, Macs, and Linux machines (without the ISOUSB211 in the path). It only fails with the ISOUSB211 present, and this is reproducible on both our board and TI&amp;#39;s own DPEVM. &amp;gt; Also, when you tested your manufactured board before shipping to customer - how did you verify the functionality before shipping? We perform a functional test on all of our own ISOUSB211 based hardware using an Apple USB C to 3.5mm adapter with standard headphones: https://www.apple.com/shop/product/mw2q3am/a/usb-c-to-35-mm-headphone-jack-adapter e2e.ti.com/.../DescriptorDump_5F00_AudioQuest_5F00_DragonFly_5F00_Red_5F00_v1.0.txt</description></item><item><title>Forum Post: RE: ISO6721: Die location in the package needed</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1649457/iso6721-die-location-in-the-package-needed/6358903</link><pubDate>Tue, 26 May 2026 15:43:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:d768508e-109b-4236-ae96-6c907bf6d9d3</guid><dc:creator>Saleem Marwat</dc:creator><description>Hi Eldin, Our devices are certified for &amp;#39;Single Protection&amp;#39; per UL 1577 and they are also certified for &amp;#39;Reinforced Insulation&amp;#39; per DIN EN IEC 60747-17 (VDE 0884-17). Additionally, our devices are also certified for &amp;#39;Reinforced Insulation&amp;#39; per UL 61010-1 &amp;amp; UL 62368-1 (certified by TUV). Regarding, any specific technical documentation, we can provide that directly to UL. You can provide your UL contact information to me and I can find out what they need. Thanks, Saleem</description></item><item><title>Forum Post: RE: ISOW7844: Clarification on Grounding Practice – Impact of Not Externally Shorting Grounds</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1649140/isow7844-clarification-on-grounding-practice-impact-of-not-externally-shorting-grounds/6358755</link><pubDate>Tue, 26 May 2026 14:41:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:d855a5c5-f4af-48e4-a1d7-338779a312c3</guid><dc:creator>Varun Kumar</dc:creator><description>HI Naveena, Thanks for reaching out. As Clemens stated below - The Issue is not clear here. Like any Isolator having an isolated ground connection is absolutely normal and does not possess any risk to the device. A schematic is the first step in understanding the connections Regards Varun</description></item><item><title>Forum Post: ISO6721: Die location in the package needed</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1649457/iso6721-die-location-in-the-package-needed</link><pubDate>Tue, 26 May 2026 14:36:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:92865778-78fa-469a-abec-06afef4693f3</guid><dc:creator>Eldin Arifi</dc:creator><description>Part Number: ISO6721 Dear TI Team, We are using the TI isolator ISO6721QDWV in one of our products to achieve reinforced insulation between two circuit sections. During the ongoing UL certification process, UL reviewed the certificate of the device and noted that, according to the available UL certification, the device is certified as a single protected device only. For our application, however, UL expects isolators used for reinforced insulation to be certified as double protected devices. To further evaluate the design, UL has requested information about the internal location of the IC/die within the package. This information is needed so that UL can assess and measure the required distances from the die location to surrounding signals and conductive parts on the PCB. Could you please provide us with a package drawing or any technical documentation showing the location of the chip/die inside the ISO6721QDWV package? This information would be very helpful for our certification assessment and may allow us to avoid layout changes at this stage of the project. Thank you very much for your support. Best regards, Eldin Arifi</description><category domain="https://e2e.ti.com/support/isolation-group/isolation/tags/ISO6721">ISO6721</category></item><item><title>Forum Post: RE: ISO64XX-WB-EVM-DOC-CERT: ISOW774x: Spice model</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1647369/iso64xx-wb-evm-doc-cert-isow774x-spice-model/6358720</link><pubDate>Tue, 26 May 2026 14:23:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:19d7c174-7ce9-4155-be87-cc738ac77c4d</guid><dc:creator>Fan Zhang</dc:creator><description>This model does not help with the internal power supply simulation, which is what I&amp;#39;m trying to do.</description></item><item><title>Forum Post: RE: ISO1050: ISO1050 CAN Communication Failure and Abnormal CANH/CANL Leakage Measurements</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1646512/iso1050-iso1050-can-communication-failure-and-abnormal-canh-canl-leakage-measurements/6358524</link><pubDate>Tue, 26 May 2026 12:29:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:ace49d8f-31ae-4523-b8d5-20e4944445f5</guid><dc:creator>Varun Kumar</dc:creator><description>Hi Dimple, Thanks for the inputs. Allow me an additional day to review these and get back to you. Regards Varun</description></item><item><title>Forum Post: RE: ISOW7844: Clarification on Grounding Practice – Impact of Not Externally Shorting Grounds</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1649140/isow7844-clarification-on-grounding-practice-impact-of-not-externally-shorting-grounds/6358229</link><pubDate>Tue, 26 May 2026 07:43:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:cef48bd3-0ec0-4370-8427-85ee1589633a</guid><dc:creator>Clemens Ladisch</dc:creator><description>The description is unclear; a system with isolators has multiple grounds and multiple devices. Please provide a schematic that shows the exact connections.</description></item><item><title>Forum Post: ISOW7844: Clarification on Grounding Practice – Impact of Not Externally Shorting Grounds</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1649140/isow7844-clarification-on-grounding-practice-impact-of-not-externally-shorting-grounds</link><pubDate>Tue, 26 May 2026 04:54:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:3eeb551a-9af8-456a-b3fc-a087ce5fd8a0</guid><dc:creator>Naveena Sanaboina</dc:creator><description>Part Number: ISOW7844 Hi, I would like to get your guidance regarding grounding practices in one of our designs. In our implementation, the ground on the isolated side of the IC is not externally shorted, and the circuit relies on the internal ground reference of the device during operation. We would like to understand the implications of this approach, particularly for long-term usage. What are the potential effects of not externally shorting the isolated-side ground? Additionally, during failure analysis, we observed that the isolated-side VCC voltage drops to approximately 1.8 V after failure . We would like to understand if this behavior could be related to the grounding approach described above or indicate another underlying issue. Your guidance on best practices for ensuring stable operation and avoiding long-term degradation would be highly appreciated. Thank you for your support. Best regards, Naveena Sanaboina Senior Electrical Engineer</description><category domain="https://e2e.ti.com/support/isolation-group/isolation/tags/ISOW7844">ISOW7844</category></item><item><title>Forum Post: RE: ISOUSB211: ISOUSB211 Packet Corruption during Enumeration?</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1637486/isousb211-isousb211-packet-corruption-during-enumeration/6357672</link><pubDate>Mon, 25 May 2026 15:04:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:57a15133-3086-409d-b4c7-914e2cfbdf11</guid><dc:creator>Varun Kumar</dc:creator><description>Hi John, Thanks for the inputs. The above information helps in understanding the selective communication/enumeration failure of the system. Let me take a step back and ask this - Is the dragonfly audio device a USB2.0 compliant device? Do you have that confirmation with proof? Also, when you tested your manufactured board before shipping to customer - how did you verify the functionality before shipping? Regards Varun</description></item><item><title>Forum Post: RE: ISO7741DBQEVM: ISO7741D Drawing High Current after 2024 February Batch</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1648892/iso7741dbqevm-iso7741d-drawing-high-current-after-2024-february-batch/6357643</link><pubDate>Mon, 25 May 2026 14:39:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:dcc2dc1c-10a2-4bb1-859d-527278837f74</guid><dc:creator>Varun Kumar</dc:creator><description>Hi Raja, Thanks for reaching out and providing the details. Before going to PCN details, the failure mode needs to be understood clearly, hence I have a few follow up questions for more clarity: Thanks for sharing the schematic and it looks good, but we would like to review the ISO7741 layout as well, especially the supply capacitor placements Failure mode of 50mA higher current - please understand that 50mA is not even the max current consumption of ISO7741. Are you sure that you mean one device is taking 50mA higher than usual? Also, which supply is taking higher current - VCC1 or VCC2? Is there a specific temperature at which communication failure is seen or is it a room temp functionality failure? How did you retrieve the data code mentioned above? Among the 4 devices and its X-rays share above - Which one is the passing device and which ones are failing device? Regards Varun</description></item><item><title>Forum Post: RE: ISO1050: ISO1050 CAN Communication Failure and Abnormal CANH/CANL Leakage Measurements</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1646512/iso1050-iso1050-can-communication-failure-and-abnormal-canh-canl-leakage-measurements/6357620</link><pubDate>Mon, 25 May 2026 13:49:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:120cf0e2-8250-4209-8364-b3465089fee0</guid><dc:creator>Dimple sai krishna Tadikamalla</dc:creator><description>Hi Varun Kumar, Thank you for your quick reply and support regarding this issue. Please find the requested details below for your reference 1.PFA the schematic PDF for your reference. We have been using the same PCB layout for the last two years without any changes, so currently I am not sharing the layout files. If required, please share your email ID and I will share the layout files through email. e2e.ti.com/.../CAN-circuit.pdf 2.PFA report. e2e.ti.com/.../CAN_5F00_IC_5F00_Test.pdf 2.a 3.The operating conditions during the failure observations are as follows: VCC1 (logic side supply): 3.3V VCC2 / isolated side supply: 5.4V Operating temperature: approximately 40&amp;#176;C CAN communication data rate: 500 kbps 4.The device was not exposed to thermal overstress before this failure started occurring. The observed operating temperature during normal operation and testing was approximately 40&amp;#176;C, which is within the recommended operating range of the device. 5.During testing, a total of 3 CAN nodes were connected on the CAN bus. The cable length used for communication was approximately 2 meters</description></item><item><title>Forum Post: RE: ISO1228: nINT pin and wirebreak bits</title><link>https://e2e.ti.com/support/isolation-group/isolation/f/isolation-forum/1645787/iso1228-nint-pin-and-wirebreak-bits/6357520</link><pubDate>Mon, 25 May 2026 11:49:00 GMT</pubDate><guid isPermaLink="false">cb01d8b2-d089-468d-babb-77d1d8683490:8e649d8f-2d64-4533-b68c-b96453a77d7b</guid><dc:creator>jose gaa</dc:creator><description>Hi Varun, any progress? Regards.</description></item></channel></rss>