This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
A problem well described is a problem well understood.
Lack of information demands unnecessary communication thereby delaying actual debug of the problem and costs time for both sides.
Here's a simple guideline for better describing issues and reducing delays in resolution.
It's just a template and all steps may not be required or applicable for every issue.
I hope below six step guideline or parts of it, as necessary, will help save everyone's time and efforts.
1. Post title
<Platform:driver name: one line statement> [ex: AM572x: eMMC: command timeout error during write to card]
2. HW description
SoC [AM5728, AM3352, DRA7XX etc] & PG - Rev 1.0, 2.0 etc
TI EVM or a custom board, IF TI EVM which Rev (A< B, G etc) or variant (IDK, uEVM etc)
Relevant device info - PMIC, DDR, CAM, DISPLAY, ETH card, PCIE card, et
3. SW description
SDK version, Kernel and U-boot version
Custom bootloader vs SDK bootloader
Application, middle ware, frameworks used
additional patches/changes done on top of an SDK
4. Problem Scenario
Describe the usecase and components involved
Events leading to the issue
Time taken to issue reproduction and Frequency of reproduction
If it's on a custom board, has it been tried on a TI HW?
5. Relevant logs
Usually - full boot log leading upto the issu
At least complete issue signature when it's not feasible to share entire boot log
Check for debug options - ex: setting "loglevel=7", "earlyprintk" in bootargs, enabling driver specific debug "CONFIG_PM_DEBUG" or "CONFIG_MMC_DEBUG", etc.
6. Attach relevant collaterals
share device tree source (dts/dtsi) files if modified or using a custom board
system block diagram for system level problems involving more than just kernel drivers
A standlone application/test case to reproduce issue when required
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.