Hello,
ADS6142-HT SLWS234 - December 2011 Datasheet has bond pad numbers 47, 50, 55, 56, 61, 64, 67, 70 and 72 with a description of SUBST. The backside potential is listed as DRVSS. Should the SUBST bond pads be connected to DRVSS along with the backside of the die?
Thank you,
David Robinson
