Hi,
I required information related to ADS5463-SP. Please confirm whether it has a thermal pad. If so, what is the dimension of the thermal pad?
Also, please provide information as to where it has to be connected.
Thank you.
-Best Regards,
Suhas
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Hi,
I required information related to ADS5463-SP. Please confirm whether it has a thermal pad. If so, what is the dimension of the thermal pad?
Also, please provide information as to where it has to be connected.
Thank you.
-Best Regards,
Suhas
Suhas,
The datasheet has the package outline drawing as an appendix to datasheet. On page 22 it shows the package drawing.
There is a heat slug, and it is 0.629 mils x 0.629mils.
Additionally, note 1 for thermal characteristics clearly states this must be connected to GND.
(1) This CQFP package has built-in vias that electrically and thermally connect the bottom of the die to a pad on the bottom of the package.
To efficiently remove heat and provide a low-impedance ground path, a thermal land is required on the surface of the PCB directly
underneath the body of the package. During normal surface mount flow solder operations, the heat pad on the underside of the package
is soldered to this thermal land creating an efficient thermal path. Normally, the PCB thermal land has a number of thermal vias within it
that provide a thermal path to internal copper areas (or to the opposite side of the PCB) that provide for more efficient heat removal. TI
typically recommends an 11,9 mm2 board-mount thermal pad. This allows maximum area for thermal dissipation, while keeping leads
away from the pad area to prevent solder bridging. A sufficient quantity of thermal/electrical vias must be included to keep the device
within recommended operating conditions. This pad must be electrically at ground potential.
Regards,
Wade
Hi Wade,
Thank you for your detailed explanation.
It is very useful.
-Best Regards,
Suhas R C