Hi,
My customer is using ADS5463-SP.
He has a question about Lid of package.
Could you let me know that which Lid is connected with, GND or Slug or Nothing(floating)?
Lid means the red part of below picture.
Best regards,
Shimizu
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Hi,
My customer is using ADS5463-SP.
He has a question about Lid of package.
Could you let me know that which Lid is connected with, GND or Slug or Nothing(floating)?
Lid means the red part of below picture.
Best regards,
Shimizu
Hi Wade,
Customer adds some questions.
Could you answer below questions, please?
Q1: About connecting Heat slug and GND.
I think that recommended Heat slug terminal processing is the connection to solid GND for thermal.
Is this correct?
Q2: If solid GND connection of Heat slug is difficult by customer situation,
Is it possible that Lid connection to solid GND for thermal as substitute idea of connection heat slug?
Q3: Customer would like to know detail raw materials information of Heat slug and Lid.
This is due to calculation of thermal expansion of Heat slug and Lid.
Could you give me this information, please?
Best regards,
Shimizu
Shimizu,
Q1) Yes
Q2) I am not sure I understand. Will device be mounted dead bug (upside down)? I am not sure implications of this. The lid would not be as good of thermal relief as the slug.
Q3) I will need to have a packaging engineer provide this data.
Regards,
Wade
I just was given correction from packaging team.
The bulk material of the lid is kovar, the heat sink is KCW-10 (sintered Copper Tungsten composite).
Regards,
Wade
Hi Wade,
The last time, Thank you support.
I add a question about heat slug.
Please see the attached file.
Customer want to know physical property of hest slug.
Customer thinks it is same as attached file information.
Is it correct?
and Does TI have information as attached file of heat slug?
Best regards,
Shimizu