Other Parts Discussed in Thread: LP2953
Is there an un-screened, engineering flow, part that fits the LP2953AMGW/883 16 lead ceramic flat pack package footprint?
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Hello Andrew
Are you looking for a mechanical sample with no die or are you looking for a package with the die in it
The LP2953AMGW/833 is mil grade and the lowest grade version of this part in a ceramic package
There is a commercial version in a plastic SOIC package that has the same pin out and footprint. See LP2953