Hi,
I think this question was raised here already and it comes again time to time as soon as a newbie comes. I would like to ask someone from Ti's team to clarify the difference between those two wording I see in Ti's datasheets. In terms of process and radiation assurance. For example LM124-SP is a Radiation Tolerant Device up to 50kRad. Does it mean that device is build from a pedigree silicon die which lot passed 50kRad up screening? Or is it an LM124 mask set build on Radiation Tolerant process like SOI and qualified as the process? Or it is something else? The same question about "Hardened". What exactly it means in terms of design modifications relative to similar EP parts or commercial?
Regards, Dmitri.