SN74LVC16T245: Thermal Shock

Hey Cedrick,

How sharply is the cooling happening? 

These devices get stress tested to JEDEC standards. You can find the performance and qualification summary by following the link under the Quality, reliability & packaging information header associated with the package you're interested in 

There are tests done on temperature cycling. Here below you'll see that the DGGR package has passed 500 cycles. The packages should be the same for the most part but i'm just showing you this as an example.

The testing follows JESD22-A104 standards. 
Given the -65/150C temperature range used for the min/max of the cycle, i'm seeing this would fall under test condition C meaning that there are a typical of 2 cycles/HR. Or ~30min per cycle. Meaning that it reached peak low and peak high conditions (-65C to 150C) in one 30min interval. Which exceeds the temperature range you're asking about, so the device should be fine to handle the temperature range. The rate at which their system is changing temperature though would be the only concern.

Here's more information I found for the JEDEC standard : http://web.cecs.pdx.edu/~cgshirl/Documents/22a104b%20Temperature%20Cycling.pdf

Hope this is helpful,
Rami

Hi Rami,

Thank you for your answer.

Cooling occurs relatively quickly. From +70 within minutes, the board gets into the chamber where it is already -40

Would the device be just fine with that condition? Thank you.


Regards,

Cedrick

Hey Cedrick,

We really can't guarantee anything outside the conditions of our testing so I can't make a definitive statement on whether the device will be fine

Rami