My customer plan to use CLXC8T245QRHLRQ1 in a fairly severe environment., ie the assembled boards must withstand: 1200 cycles between -40 / + 125 ° C.
DFN or QFN packages assembled on PCB are generally not the most resistant to strong climatic constraints.
Will our device handle that stress?
Are we able to provide information about the climatic endurance tests that this component can withstand, specifying the min / max temperatures and the number of cycles.
Thanks Josef