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SN74LXC8T245-Q1: Temperature stress cycles - Device robustness

Part Number: SN74LXC8T245-Q1

My customer plan to use CLXC8T245QRHLRQ1 in a fairly severe environment., ie the assembled boards must withstand: 1200 cycles between -40 / + 125 ° C.
DFN or QFN packages assembled on PCB are generally not the most resistant to strong climatic constraints.

Will our device handle that stress?
Are we able to provide information about the climatic endurance tests that this component can withstand, specifying the min / max temperatures and the number of cycles.

Thanks Josef 

  • Hi Josef,

    This Q1 device is rated at exactly -40 and 125 C for all packages. We are not able to guarantee reliability past these limits.  

    For the actual tests, I am not sure if we are able to release this information I will have to get back to you next week.