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SN74AUP2G07: Stencil design for 0.35mm Pitch SON

Xiaowei huang
Prodigy 10 points
Part Number: SN74AUP2G07
Other Parts Discussed in Thread: SN74AUP2G08

Hello, we found different stencil designs(opening and thickness) recommended on data sheets of SN74AUP2G07(6-pin SON, 0.35mm pitch) and SN74AUP2G07(8-pin SON, 0.35pitch), see images below. we think that they shall have the same stencil design. and what is recommended mesh size of solder paste, type4 or type5? thanks!

  • 0
    TI__Genius 13620 points

    Hi Xiaowei,

    These are two different packages. The stencil on the left is for the SN74AUP2G07 in the DSF package and the stencil on the right is for the SN74AUP2G08 in the DQE package. These should not have the same stencil design.

    Note the DQE package for the SN74AUP2G08 has a (0.6mm X 0.175mm) pin 1 dimension while the rest of the pins are (0.5mm x 0.175mm). The pin dimensions for the SN74AUP2G07 in the DSF package are (0.6mm x 0.17mm). Are you trying to create a dual footprint? 

    We don't recommend a particular mesh size for solder paste, it is up to the customer. 

    Regards,

    Sebastian 

  • 0 in reply to Sebastian Muriel
    Prodigy 10 points

    Hi Sebastian,

    Thanks for your quick answer!

    Our concern is more on the stencil thickness: the recommendation for SN74AUP2G07 is 0.125mm, while 0.075mm for SN74AUP2G08. We believe 0.125 is not suitable for 0.35pitch SON. Please help to check if you have conducted some kind of process trials or have experience from mass productions. 

    Rgds,

    Xiaowei

  • 0 in reply to Xiaowei huang
    TI__Genius 13620 points

    Hi Xiaowei,

    I'm reaching out to our packaging team to see if they have any insight regarding the stencil thickness. I will reply here when I hear back from them. 

    Regards,

    Sebastian 

  • 0 in reply to Sebastian Muriel
    TI__Genius 13620 points

    Hi Xiaowei,

    Thanks for pointing out this issue, the datasheet has been updated with the appropriate stencil thickness. 

    Regards,

    Sebastian