Hello TI team,
please help to check the CTE information. thanks.
|Part CTE||PCB CTE|
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For precise information, an NDA is required which you would work with your local TI sales office to arrange. The TI FAE can contact me regarding specific details in a non-public forum.
If you just need general values of CTE for components of the device, then I can provide those here:
Copper (primary metal for lead-frame construction) ~17 ppm/⁰C
NiPdAu coating (outer layer of leadframe) ~13 ppm/⁰C
Sn coating (alternate outer layer of leadframe) ~21.5 ppm/⁰C
Mold compound (plastic body) ~12 ppm/⁰C
Silicon ~2.6 ppm/⁰C