Hello,
I am looking at TI parts SN74AC14QPWRQ1, LM211QDRG4Q1, & LM211QDRQ1 which are affected by PCNs that state a change in leadframe surface from standard NiPdAu to roughened NiPdAu. SN74AC14QPWRQ1 is affected by PCN 20161017001 and LM211QDRG4Q1 & LM211QDRQ1 are affected by PCN 20150624002A.
Can you please explain what is the difference between the two terminal finishes?
Can you also provide the Pd & Au plating layer thickness for both types of finish? This will help us determine if we need to send these parts out for hot solder dip (HSD) per our Lead-Free Control Plan (LFCP).