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Original question:

[FAQ] What is the thickness of Gold (Au), Palladium (Pd), or Nickel (Ni) for TI's NiPdAu lead finish?

SN74LVC1G04: General Inquiry for Ni Au Pd plating

Renan Santos Adriano
Mastermind 18560 points

Tool/software:

Hello Team,

I need an information regarding the reflow profile of components with Ni Au Pd plating.

I have to produce PCBA in SnPb process with peak max at 220°C. In my opinion, the RoHS process with peak max at 245°C will be more adapted in case of NiAuPd finishing. I'm not sure that the intermetallics will be sufficient with SnPb process.  I’d just need a confirmation > Is the Ni Au Pd plating is compatible with Sn Pb profile ?

Thank you for your help.

Regards,
Renan

  • +1
    TI__Expert 3071 points

    Hi Renan,

    The reflow profiles are characterizations of the solder used, not of the leads. If you are using lead solder, the SnPb profile is compatible with the NiAuPd plating, but if you are using lead-free solder, it is not.

    https://www.ti.com/lit/an/spraby1a/spraby1a.pdf

    This document has the reflow profile for non-leaded solder.

    Best,

    Ian

  • 0 in reply to Ian Graham
    TI__Mastermind 18560 points

    Hello Ian,

    Follow up from my customer:

    I’am sorry to insist but by the past we received this information from another partner (ONSEMI) and this had been confirmed by a metalographic cut (insufficient intermetallic) :

    « lead free solder alloy plating made of PdNiAu. The PdNiAu alloy has a different composition and melting point compared to SnPb solder. It is designed to be used as a lead-free alternative for specific applications where higher reliability and performance are required.

    Soldering with SnPb solder requires a different temperature profile that is suitable for the lower melting point of the SnPb alloy. Attempting to solder the PdNiAu alloy with SnPb solder and a lead temperature profile may result in insufficient heating or overheating, which can lead to poor solder joint formation, insufficient wetting, and potential damage to the components, therefore we do not recommend to solder this device with lower soldering profile »

     Temperatures are different between twice process ; the NiAuPd plating seems to be more adapted for Lead free process in order to obtain a good intermetallic.

    Regards,

    Renan

  • 0 in reply to Renan Santos Adriano
    TI__Expert 3071 points

    Hi Renan, 

    The information we have from this comes from solder paste vendors. I recommend talking to the vendor of the customer's solder paste. They may have the data you're looking for.

    Best,

    Ian