Part Number: SN74HC02
Hello Team,
One of our customers purchased 200 units of SN74HC02PWR and claim all the parts (200 ) are oxydated. As per customer,
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"The oxidation problem prevents proper soldering in accordance with IPC (soldering standard). This defect forced us to rework our boards and caused a delay."
For the manufacture of our electronic cards using this component with poor solderability, we use an ERSA Hotflow 3/20 reflow oven configured as follows for this manufacturing process:
This oven has 10 heating zones and 4 cooling zones, offering excellent consistency. It is checked weekly to ensure there are no deviations. No oven deviations have been observed in recent years. We manufactured these boards using a lead-free process with ALPHA OM-338-PT solder paste.The oven profile corresponds to the profile specified by the solder paste manufacturer and is not in question, as we comply with the solderability criteria set out in the IPC-A-610 standard.These criteria were not met for this component:in this photo, the completely oxidized leads, placed on the solder, do not provide sufficient wetting.We store our components in an air-conditioned room with controlled temperature and humidity, set at 21C. No drift or alerts have been detected.All our indicators and control methods are within manufacturing tolerances and we have not observed any deviations. On the entire board,
this component is the only one with a wetting defect and extremely oxidized leads that do not comply with the IPC-A-610 standard. The oxidation of this component is not our fault, and we were forced to
halt production because of this defect."


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These parts come from following tracing,
DC: 2341
LC: 3780683ML3
Can you please if this issue can be solved in any way as this is delaying customer production.
Thank you and kind regards,
Usman
441036