All,
Can anyone tell me where to find the bond wire info for TI devices?
I am using the 74HC14. But there are different flavors, trying to find the one with gold wires if any.
Thanks,
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All,
Can anyone tell me where to find the bond wire info for TI devices?
I am using the 74HC14. But there are different flavors, trying to find the one with gold wires if any.
Thanks,
Fubin,
What package size are you interested in?
SOIC-14 (D).
Another question is the Automotive one rated for -40 to 125C but the catalog is -55 to 125C? Right?
Fubin,
It looks like the orderable part number SN74HC14DRG4 is made with gold bond wires.
The part number SN74HC14 (catalog) has an operating range of -40 C to 85 C. The military grade part, SN54HC14, is rated -55 C to 125 C. The automotive qualified part, SN74HC14-Q1, is rated for -40 C to 125 C.
James,
Thanks a lot for the info. I think I mixed up things here. I compared CD74HC14 (HC14M marking) with SN74HC14 (HC14 marking). All the CD74HC14 devices are Harris Semi. They look really identical.
Here are few more questions:
1) Are all SN74HC14 devices made on the same silicon process? CD74HC14 too?
2) Are these devices using the same mold compound?
3) Are CD74HC14 device with Gold wires?
Thank you again for the info.
Regards,
Fubin
Hi Fubin, I am looking into this with the product engineering & packaging team. I will let you know as soon as I hear back.
-Ryan
Hi Ryan, Thank you for looking into these. I was surprised that the catalog parts used the Gold wires but the Automotive switched to Copper wires. The problem I have here is the CD74HC14 SOIC-14 devices failed after extreme thermal shocks. Hopefully, your info can help me pick the best candidates.
Thanks again,
FZ
Ryan,
Could you confirm if SN74HC14QDRQ1 device are made of gold wires or copper wires? Thank you!
Regards,
Fubin