I am using the T.I. SN74LVC1GX04 in the DRL package, but am having problems with reflow soldering. The SN95/AG05 solder does not want to wet to the package leads. The DRL just floats on top of the solder. The other chip components & various I.C.'s around it on the pcb look good. Are there any app. notes to help with this or can you offer me any guidance? Thanks