SN74ALVC244-EP: Junction to Case Thermal Resistance

Michael,
I am in a discussion with our thermal modelling team. Theta Jc (bottom) is not normally provided for this package type.
It is not considered directly applicable for devices without thermal pads that are physically contacting the board. I am requesting their advice, and will post back with more information.
Can you describe how you intend to mount the devices to the board? Will there be air gap, or use of some thermal paste or adhesive?
Regards,
Wade

Michael,
This should not be labeled as "TI thinks resolved" That was an accident.

If you could provide information on how you would use the Theta Jc Bottom, then I can provide this to our modelling team for consideration. There is concern that use of this parameter (for devices without thermal pads) would lead to erroneous calculations. Please provide this information, and we can hopefully move forward with this request and your other thermal request for the AM26LV32E-EP.
Regards,
Wade

Wade,

Theta JC (bottom) is probably not the right way to express what I'm looking for. I am trying to calculate Theta JB and have been calculating the resistance from the leads using the material and the drawing information. Therefore what I am really looking for is a Theta junction-to-lead; although, a Theta JB would be more useful if available.

The plan is to not use thermal pads or paste unless it is needed. The hope is that the calculations will show that it is not needed.

Please let me know if additional information is needed.

Thank you,
Mike

I have requested the generation of our standard model set, and it will include Theta JB.
I will post here when complete.
Regards,
Wade

Wade,

Any update on this?

Thank you,
Mike

Thank you Wade!