SN74LVC374A: Coefficient of Thermal Expansion (CTE) for Several Parts

David Weisenberg

Intellectual 510 points

Part Number: SN74LVC374A

Hi! I'm doing a thermal cycling analysis for an assembly that uses a LOT of T.I. parts.

Can you please tell me the coefficient of thermal expansion (CTE) for the following parts:

SN74LVC374AQPWREP

SN74LV393ATPWREP

SN74LVC1G00MDCKREP

SN74LVC1G32MDCKREP

CD74HC4017QPWREP

SN74LVC74AMPWREP

(I apologize for the large number of parts!)

Thanks in advance for your help!

over 5 years ago

0 Wade Vonbergen over 5 years ago

TI__Guru 62930 points

David,
All of the CTE's for the plastic encapsulated devices will have the same result as noted in this e2e post: e2e.ti.com/.../789140

The CTE of mold compounds is considered NDA and will take more effort to provide if necessary. For BLR and solder studies, I would expect that the mold compound has minimal to no influence compared to the leadframe.

Regards,
Wade

0 David Weisenberg over 5 years ago in reply to Wade Vonbergen

Intellectual 510 points

Thank you! I very much appreciate the information.

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SN74LVC374A: Coefficient of Thermal Expansion (CTE) for Several Parts