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CD74HC04: Rough leadframe package for DIP/THT version of CD74HC04E

Expert 6310 points
Part Number: CD74HC04

Hello,

We have available information on rough leadframe (RLF) for SMD parts (http://e2e.ti.com/cfs-file/__key/communityserver-discussions-components-files/196/Application-note-Rough-LeadFrame.pdf and  http://e2e.ti.com/cfs-file/__key/communityserver-discussions-components-files/138/SOIC-Solderability-Test-_2D00_-rough-lead_2D00_frame.pdf)

Can you help to confirm that even a DIP package can be produced like this?

Device: CD74HC04E

Thank you.