Hello,
We have available information on rough leadframe (RLF) for SMD parts (http://e2e.ti.com/cfs-file/__key/communityserver-discussions-components-files/196/Application-note-Rough-LeadFrame.pdf and http://e2e.ti.com/cfs-file/__key/communityserver-discussions-components-files/138/SOIC-Solderability-Test-_2D00_-rough-lead_2D00_frame.pdf)
Can you help to confirm that even a DIP package can be produced like this?
Device: CD74HC04E
Thank you.