TWL1200: The details of size about TWL1200YFFR(R-XBGA-N49)

yoko-s

Prodigy 180 points

Part Number: TWL1200

I marked the point in the picture for your information.

Could you tell me the size about following?

１．E: Value of TYP and MAX

２．D: Value of TYP and MAX

３．X(the diameter of the top(surface) of the BGA ball when it contacted with the package).

over 3 years ago

0 Emrys Maier over 3 years ago

TI__Guru* 96591 points

Hi Jun,

The maximum package size is 2.80 mm x 2.80 mm.

Minimum size is 2.70 mm x 2.70 mm.

Typical size is 2.76 mm x 2.76 mm

Ball diameter size is 0.2 mm (min) to 0.3 mm (max) -- 0.25mm typical. Contact area on the die is not provided.

We recommend to use 0.25 mm size pads with at least 1 oz copper - prefer not solder mask defined.

More details on TI's recommendations for WCSP packaging here: Wafer level Chip Scale Package FAQs

0 yoko-s over 3 years ago in reply to Emrys Maier

TI__Prodigy 180 points

could you tell me why the "Contact area on the die is not provided"

0 Emrys Maier over 3 years ago in reply to yoko-s

TI__Guru* 96591 points

Yes - that is information that is protected by restrictions within TI. We don't share our designs, in full or in part, publicly.

0 yoko-s over 3 years ago in reply to Emrys Maier

TI__Prodigy 180 points

In this case,

I was told by my customer that "the limit of board is φ0.23m, the 0.25 mm size pads which you recommend is impossible."

how should I support this case.

0 Michael J Schultis over 3 years ago in reply to yoko-s

TI__Mastermind 24485 points

Hello Shun,

We will get back to you after our US holidays.

Thank you for your patience.

Michael

0 Emrys Maier over 3 years ago in reply to yoko-s

TI__Guru* 96591 points

Hello,

I can only provide the recommendations from TI. If the customer is not able to manufacture the board within our constraints, they can either change the pad sizes to match their constraints, or they can change to a different solution.

0 yoko-s over 3 years ago in reply to Emrys Maier

TI__Prodigy 180 points

Could you please tell me if TWL1200-Q1 has EOL plan in next 3 years?

or other new device to instead of TWL1200?

My customer was using TWL1200(BGI -package) which will be EOL.

So they want to change to TWL1200-Q1.

They are worrying about if TWL1200-Q1 also will be EOL in future.

0 Emrys Maier over 3 years ago in reply to yoko-s

TI__Guru* 96591 points

Hello,

In the future, please start a new thread for new questions -- we like to keep these separate to help people find what they're looking for faster and easier when searching. If you want to link to the original thread, there's a "+ Ask a related question" button in the top right corner that allows you to do this.

The TWL1200 is unique in our portfolio, so there's no other single device that would replace it.

The ZQC package itself is being EOL'd, not specifically the TWL1200. There are no plans to EOL this device in the near future.

Logic

Logic forum

TWL1200: The details of size about TWL1200YFFR(R-XBGA-N49)