Other Parts Discussed in Thread: SN74LVC1G07, SN74LVC1G125, SN74LVC1G126
Hi I am trying to understand the what is meant when some data sheets indicate support for Ioff some data sheets like the subject part indicate Ioff Supports Live Insertion,Partial-Power-Down and Back-DriveProtection.
I have looked at the TI application report SCEA026 - February 2002 which lays out three levels of live insertion isolation/protection (Level 0 to 3).
In this document they talk about:
- Ioff as a static statement of inputs/outputs of the device can have voltage on them when VCC=0 without causing current into the IOs. This capability is Level 1 Isolation (Partial Power Down).
- Power Up 3 State Circuitry which the device remains in the high-impedance state from a power-supply voltage of 0 V to a specified voltage. This capability is Level 2 Isolation (Hot Insertion).
- Precharged IOs to reduce glitching on a active bus that device is live inserted on. This capability is Level 3 Isolation (Live Insertion).
Can you please help point me to a more recent document that describes what is claimed/meant by statements like I referenced in the subject datasheet? If there is ot such document can you please describe what is meant by the statements and point to the particular specs that are supporting the statement? Also if there is a selection guide that lays out which logic families support the different features would be helpful.
In my particular application I need a device that will operate correctly down to a specified voltage and then tri-state the output. In the picture below I need the input of the 07 to not impact the signal being pulled up by VCC_A when VCC_B is transitioning between 3.3V and Gnd.
In the picture below I need the output of the 07 to represent faithfully the logic level on the input as VCC_B transitions from 3.3V to a specified voltage and then tri-states the output as VCC_B drops from the specified voltage to GND.