I would like a direct guide on how to test this die prior to wire bonding it into our product. Does TI provide plans for a die test fixture?
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I would like a direct guide on how to test this die prior to wire bonding it into our product. Does TI provide plans for a die test fixture?
Hello, and welcome to the forums!
The best guide for testing is the datasheet. The EC table provides a set of DC characteristics, test conditions, and their associated limits.
The die can also be tested against the switching characteristics.
Are you buying a special type of untested die? We usually test all devices we ship against the datasheet specs, so it seems like overkill to test before bonding out, then test again after bonding out. The most likely time to damage the device would be during the bonding process.