This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
In Fig 1 Load Circuits and Voltage Waveforms on page 5 of the datasheet (SDAS025D, April 1982 - Revised March 2002), there are three load circuts: 1) RL from output to GND, 2) RL from output to Vcc, 3) R1 with S1 to 7V from output, and R2 from output to GND.
In our design, the output of SN74ALS541 is going to connect to the input of a TTL device. We have the following questions:
a) which load circuit should be used between the output of SN74ALS541 and the input of the TTL device: 1, or 2, or 3?
b) if the load circuit 3 is used between the two devices, could R1 connected to Vcc instead of 7V?
c) when R1 (560 ohm) is connected to Vcc, the VoH is jumping between 3.2V and 2.4V (see the attached file), is this the expected outcome?
d) when the load circuit 1 (RL=560 ohm) is used, the VoH is jumping between 3.2V and 2.4V (see attached file), is this the expected outcome?
e) does this device have an output damping resistor? If not, should that be ok to put a 25 ohm damping resistor between the output and the input of the next TTL device?
Watch the Introduction to AXC Family
Read the app note on Glitch-free Power Sequencing for the AXC family
Evaluate the AXC8T245 EVM and watch the translation using the EVM
We are glad that we were able to resolve this issue, and will now proceed to close this thread.
If you have further questions related to this thread, you may click "Ask a related question" below. The newly created question will be automatically linked to this question.
In reply to ShreyasRao:
Thank you very much for the reply.
What is the value of the bypass cap for Vcc, which you could recommend?
Also, in my previous email, I was asking: "if the load circuit 3 is used between the two devices, could R1 connected to Vcc instead of 7V?", could you let us know, if you please let us know the answer for it?
In reply to Mark Liang:
All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.
TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs andembedded processors, along with software, tools and the industry’s largest sales/support staff.