Hi team,
Could you please help for the TXB0106 thermal and power dissipation information?
|
Manufacturer P/N |
Max Junction Temperature('C) |
Thja(C/W ) |
Thjc(C/W ) |
Power Dissipation (W) |
Output Current |
|
TXB0106PWR |
150 |
107.2 |
34.9 |
|
0.05 |
BR,
SHH
Hi SHH,
The maximum junction temperature the device above is 150C, as explained in our FAQ section here: 
Power dissipation is a much more complex question. This is not a power delivery device, and is only intended to pass signals... so the majority of power dissipated is in dynamic power, which is related to how the device is being used. I would recommend referring to this application report for details: CMOS Power Consumption and CPD Calculation (Rev. B)
