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SN74AXC8T245-Q1: Ground pad connectivity

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Part Number: SN74AXC8T245-Q1

Hello,

Is the Pad of the CAXC8T245QRHLRQ1 internally connected to ground?  The datasheet does not appear to specifically specify one way or the other.  It says it can be left floating or connected to ground, but does not indicate internal connectivity.

Thank you,
Christopher

  • Hi Chris,

    Here is an appnote that helps answer your question.

    http://www.ti.com/lit/an/sloa122/sloa122.pdf

    The thermal pad does not have any internal electrical connections. It is provided to be able to sink heat effectively from the die. It is recommended to connect the thermal pad to GND as most circuit boards have a large surface area for the GND node allowing for heat to dissipate faster. However, if heat is not a concern in your design, then you can leave the pad floating.

    Thanks!

    -Karan

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