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SN74LVC1G08: Footprint size check of X2SON package

Part Number: SN74LVC1G08

Hi team ,

my customer is using SN74LVC1G08 as solution and have a questions on footprint size X2SON package , 

1. per d/s package figure( fig.1) and solder mask (fig2) , fig1 shown the the space between 2 pin is around 0.26mm(distance 4) , but fig.2 shows that the distance(yellow mark) between 2 pin is around 0.36mm(0.78mm-0.42mm) , is there's any typo on this, or is there's any understanding wrong?

 2. fig.1 shown's the package size is 0.8mm*0.8mm , fig2 (pin A,B,VCC,Y) have solder mask outside the package size(red circle) , is this is on purpose just to make it easier for locate the IC when soldering

fig.1

fig.2

  • Hi Andy,

    The second picture is the land pattern (what the traces on the PCB will connect to) while the first is the actual package. That is why there are these differences.

    Example land pattern is given to allow best signal and physical integrity. There are no typos.

    Thanks!

    -Karan

  • Hi Karan,

    thanks for feedback, so customer should reference  above fig.1 package for the actual footprint size , is that correct?

    FYI , there's also solder paste example fig in d/s , customer can also reference this for layout footprint , is that correct?

    Andy

  • Hi Andy,

    Yes, the first figure will give you the actual shape of the pins on the device.

    The second figure should be used on the pcb layout to allow enough solder on the pads to have a proper connection. This is why its slightly bigger.

    Thanks!

    -Karan