Hi team ,
my customer is using SN74LVC1G08 as solution and have a questions on footprint size X2SON package ,
1. per d/s package figure( fig.1) and solder mask (fig2) , fig1 shown the the space between 2 pin is around 0.26mm(distance 4) , but fig.2 shows that the distance(yellow mark) between 2 pin is around 0.36mm(0.78mm-0.42mm) , is there's any typo on this, or is there's any understanding wrong?
2. fig.1 shown's the package size is 0.8mm*0.8mm , fig2 (pin A,B,VCC,Y) have solder mask outside the package size(red circle) , is this is on purpose just to make it easier for locate the IC when soldering
fig.1
fig.2