Dear Sirs
I've noticed the land pads for the 2N7001TDPW package are larger than the solder mask. This is causing some creepage issues in my design. Is the reason for the land pad size for heat dissipation? I'm using this part for voltage translation (1.8V to 3.3V) on high speed digital circuits. The input impedance on the 1.8V and 3.3V devices is very high. Can I make the land pads smaller?