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2N7001T: Land pads larger than solder mask.

Part Number: 2N7001T

Dear Sirs

I've noticed the land pads for the 2N7001TDPW package are larger than the solder mask.  This is causing some creepage issues in my design.  Is the reason for the land pad size for heat dissipation?  I'm using this part for voltage translation (1.8V to 3.3V) on high speed digital circuits.  The input impedance on the 1.8V and 3.3V devices is very high.  Can I make the land pads smaller?

  • The junction-to-board thermal resistance is 326.5 °C/W; large pads would be pointless for heat dissipation.

    The drawing on p. 21 is labeled "land pattern example" "solder mask defined". You are not required to use that example, and can use copper-defined pads instead (just exchange the copper and mask outlines).

    Copper-defined pads are not as mechanically strong as solder-mask-defined pads, but this does not matter for a device as small as the 2N7001T.