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Leadframe material - by package or family?

Bill Mackin
Intellectual 420 points
Part Number:

My question is regarding the leadframe material used on logic IC's (Kovar, Copper, Alloy42, etc.).

Does TI use the same leadframe material for given packages, or per part family, or some other factor?

Is the leadframe information available on the website?

Thank you.

  • 0
    TI__Guru 71516 points

    Hello Bill,

      There is a Material Content Search page, by Part Number: http://www.ti.com/materialcontent/en/home .  

    As well, a page that discusses leadframe conversion to lead-free: http://www.ti.com/support-quality/environmental-info/lead-free.html .  

    I know these are general discussions and references, so if you have something specific for a device, please let me know.

    Regards,

    ~Leonard  

  • 0 in reply to LeonardEllis
    Intellectual 420 points

    The material content doesn't have a lot of data.  I'm looking for something that says the mold compound is nn% silica, n% carbon black, the leadframe is %iron, %nickel, %copper, the bond wires are gold, Pd-coated Cu, etc.  Part of the data we store, especially for tin whisker risk analysis, is the leadframe composition (not just the leadframe finish).  The composition of the leadframe itself is important to evaluate the tin whisker risk.  Our choices are Copper, Brass/Bronze, Nickel, or Low-Expansion Alloy (for the material under the final terminal finish.  These values allow us to determine a numerical level of whisker-formation risk.

  • 0 in reply to Bill Mackin
    TI__Guru 71516 points

    Hi Bill,

     The detailed content report you are asking about is available, but on a part number specific basis.  For example, if you go to the Material Content page I referenced, enter a part number in the SEARCH box, for example SN74HC245 (search) you will see a list of specific part numbers.  Click on the first one SN74HC245N in the TI Part number column, you will see a new page with the material details:

    Component Information

     Homogeneous Material LevelComponent Level
    ComponentSubstanceCAS NumberAmount (mg)Percentage %ppmPercentage %ppm
    Bond Wire
    Copper and Its Alloys Iron 7439-89-6 0.000001 0.000339 3 0.000000 0
    Magnesium and Its Alloys Magnesium 7439-95-4 0.000001 0.000339 3 0.000000 0
    Other Nonferrous Metals and Alloys Beryllium 7440-41-7 0.000003 0.001018 10 0.000000 0
    Other Nonferrous Metals and Alloys Calcium 7440-70-2 0.000009 0.003053 31 0.000001 0
    Other Nonferrous Metals and Alloys Yttrium 7440-65-5 0.000009 0.003053 31 0.000001 0
    Precious Metals Gold 7440-57-5 0.294795 99.990164 999902 0.017556 176
    Precious Metals Silver 7440-22-4 0.000006 0.002035 20 0.000000 0
    Sub-Total     0.294824 100 1000000 0.017558 176
    Die Attach Adhesive
    Precious Metals Silver 7440-22-4 0.290692 70.000048 700000 0.017312 173
    Thermoplastics Epoxy 85954-11-6 0.124582 29.999952 300000 0.007419 74
    Sub-Total     0.415274 100 1000000 0.024731 247
    Lead Frame
    Copper and Its Alloys Copper 7440-50-8 373.891957 97.701000 977010 22.266471 222665
    Copper and Its Alloys Iron 7439-89-6 8.189566 2.140000 21400 0.487715 4877
    Copper and Its Alloys Phosphorus 7723-14-0 0.126288 0.033000 330 0.007521 75
    Zinc and Its Alloys Zinc 7440-66-6 0.482189 0.126000 1260 0.028716 287
    Sub-Total     382.690000 100 1000000 22.790423 227904
    Lead Frame Plating
    Nickel and Its Alloys Nickel 7440-02-0 29.496712 95.120000 951200 1.756624 17566
    Precious Metals Gold 7440-57-5 0.241878 0.780000 7800 0.014405 144
    Precious Metals Palladium 7440-05-3 1.271410 4.100000 41000 0.075720 757
    Sub-Total     31.010000 100 1000000 1.846745 18467
    Mold Compound
    Other Inorganic Materials Fused Silica 60676-86-0 900.546509 71.300000 713000 53.630447 536304
    Other Nonferrous Metals and Alloys Antimony Trioxide 1309-64-4 5.052154 0.400000 4000 0.300872 3009
    Other Organic Materials Brominated Epoxy 40039-93-8 25.260772 2.000000 20000 1.504360 15044
    Other Plastics and Rubber Carbon Black 1333-86-4 3.662812 0.290000 2900 0.218132 2181
    Thermoplastics Epoxy 85954-11-6 328.516335 26.010000 260100 19.564206 195642
    Sub-Total     1,263.038582 100 1000000 75.218018 752180
    Semiconductor Device
    Ceramics / Glass Doped Silicon 7440-21-3 1.721570 100.000000 1000000 0.102530 1025
    Sub-Total     1.721570 100 1000000 0.102530 1025

    Total

    		     1,679.170250     100 1000000

     

    This will provide the detailed information you are requesting.

    Regards,

    ~Leonard