Part Number: TXS0108E
Why does TXS0108 recommend to place via ?
Is it for improvement thermal performance ?
They will design via with phy0.4.
Is if ok for the phy size ?
Thank you and best regards,
Where does TI recommend vias? The RGY package drawing says that "vias are optional".
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In reply to Clemens Ladisch:
Could you share the data of Junction-to-ambient thermal resistance for the RGY pkg with no vias ?
In reply to Michiaki Tanii:
The junction-to-ambient thermal resistance, RθJA, is determined assuming only basic solder connections to a standard board and no additional heatsink.
If you are attempting to calculate thermal dissipation through the bottom of the device with added vias, use RθJC(bot) in combination with your heatsink's thermal properties.
In reply to Emrys Maier:
Customer would like to use vias with phy 0.4.
Is it ok for the above ?
There is no right or wrong way to add vias to the thermal pad - so long as the pad is either floating or connected to ground. It's up to the customer to decide on their needs for thermal performance.
Please share the RthetaJA and RthetaJC of RGY pkg without thermal pad ?
I understand what you mentioned but I cannot estimate the thermal performance in the worst case.
Can you tell me why this is so critical? It is highly unusual for a voltage translator to require such lengths to calculate thermal dissipation. The device typically dissipates very little power.
I know what you want to say but how can customer judge without information thermal resistance ?
There would be no concern even if customer doesn’t use thermal pad but they need evidence.
Your understanding would be highly appreciated.
How can I help if the application information is not shared with me?
I have requested a thermal model without the thermal pad, but I'm not sure what you expect to learn from this. Why would the customer design with no connection for the thermal pad?
If there is enough information to produce a model from the request, it will be return in approximately two weeks.
Customer just would like to know if they can use phy 0.4 or not.
And I asked you the thermal resistance without thermal pad as worst case since you mentioned it depends on customer’s design requirements.
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