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SN74LVC8T245: Junction to Base (Bottom)

Mark Philip Felipe
Genius 9705 points
Part Number: SN74LVC8T245
Other Parts Discussed in Thread: SN74LVC1G11

Hi Team, we would like to confirm if there is data from Junction to Base (Bottom) for SN74LVC1G11 - DCK package and SN74LVC8T245 - - RHL package.The parts is intended to cool down on PCB as well. Do we have data for this?

Thank you in advance for your inputs.

-Mark

  • 0
    Guru 243820 points

    There is no data.

    In another thread, Michael J Schultis wrote:

    Since there is no thermally conducting pad on the bottom of the device, adding any epoxy from the plastic bottom of the package to the board is not going to help with thermal transfer because the vast majority of the thermal conductivity is going to happen through the leads.

    I honestly would not recommend adding an epoxy to the bottom of the chip, as I don't believe that it would provide any benefit. Its safe to assume any change would be negligible. 

    The device is unlikely to heat up that much anyway as its not a power chip or something that is conducting a lot of current, so in general thermals on a simple logic buffer device is not going to be a concern.