TMS570LS3134's behavior under the pins short condition (ZWT = BGA package) -- SafeTI

Hideaki Nambu

Sirs,

I have questions for the TMS5703134CZWTQQ1's (BGA package) behavior under the pins short condition.
Are there any materials in the SafeTI which describes pin-to-pin short by an external elements like solder?

I mean external shorts, but if not available I wonder the FMEDA might explain a resemble information like single pin defects?

-n

over 9 years ago

0 Zhaohong Zhang over 9 years ago

TI__Mastermind 22715 points

Hi, there.

Thanks you for posting in the forum. I have forwarded your question to a safety expert. He will answer the question shortly.

Thanks and regards,

Zhaohong

0 KGreb over 9 years ago

TI__Mastermind 23000 points

Hello,

We do not provide a pin FMEA. Because of the wide variety of behaviors that are possible with the pin muxing logic such analysis is very specific to each application.

The overall probability of I/O pin failures is considered in the FMEDA spreadsheet and customer can use this to support their analysis. In the IEC/TR 62380 failure rate estimation model used, Table 15 suggest that 90% of I/O failures will be open circuit rather than shorts.

Regards,

Karl

0 Hideaki Nambu over 9 years ago in reply to KGreb

Mastermind 9125 points

Karl and Zhaohong,

I appreciate your responses. Very clear.

Arm-based microcontrollers

Arm-based microcontrollers forum

TMS570LS3134's behavior under the pins short condition (ZWT = BGA package) -- SafeTI